Semiconductor Testing and Testing Equipments

Technologies

• Aspect ratio up to 25
• Big size board assembly
• Board flatness <0.3%
• Board thickness 9.1 mm
• Embedded component PCB
• High speed and low loss materials
• Layer count up to 40
• Minimum line width / spacing 2 mil
• VIP (via in pad) :
  conductive-conductive copper paste ;
  non-conductive-epoxy via hole fill

Applications

Burn-in, load board and probe Card.