Optical Fiber Communication Systems

Technologies

• Any layer HDI
• Aspect ratio up to 25
• Back drill
• Board thickness 10 mm / 390 mil
• Cavity down
• High speed and low loss materials
• Layer count up to 40
• Micro via copper-fill plate
• Minimum line width / spacing 2 mil
• Thermal management-coin inserted
• VIP (via in pad) :
  conductive-conductive copper paste ;
  non-conductive-epoxy via hole fill

Applications

Optical Fiber Conversion Module, Ethernet Module, Small form Factor Pluggable (SFP) System and Thunderbolt.